Our Own PCB Dust-Free Room

Nitrogen-Atmosphere Reflow Oven
We run every IGBT control board through a nitrogen-atmosphere reflow oven using a carefully controlled heat curve — confirming each solder joint is electrically sound before the board leaves the line. A single weak or hollow joint can disrupt the gate-drive signal, causing the board to fail under full cooking load.
● A ten-zone heat profile matched to lead-free solder requirements — preheat, soak, reflow, and cooling stages are each individually tuned to protect sensitive components from heat shock.
● A nitrogen-filled atmosphere kept below 1,000 ppm oxygen — reduces oxidation and produces solid, void-free joints that hold up through years of thermal cycling in commercial kitchens.
● An in-line AOI scan runs immediately after reflow — every board is checked for solder bridges, lifted components, and insufficient solder before to the next stage.
● A locked recipe for each board part number — every PCB variant follows a pre-validated heat profile, removing variation from shift to shift.
Cooling Fan Assembly & Inspection
As a commercial induction cooker specialist, we hand-assemble and test every cooling fan module before it goes into the main unit. The fan is the only active measure keeping the IGBT module at a safe temperature — a single underperforming fan can trigger a thermal shutdown during a busy service.
● Fan speed and airflow are verified on every unit — each module is bench-tested against a minimum airflow threshold to confirm it can handle full-load cooling conditions
● The wiring harness is routed and secured to spec — connectors are checked for firm seating and correct polarity, preventing loose or intermittent faults after final assembly
● Every module is screened for vibration and noise before sign-off — operators check by hand and ear for bearing irregularities that could lead to early fan failure in a working kitchen
● Each unit’s serial number is logged at the station — every assembled fan module is tied to a traceable production record for full after-sales accountability


Manual DIP Component Insertion
We hand-insert every high-power through-hole component — IGBT modules, filter capacitors, relays, transformers, and heat-sink assemblies — onto the PCB before wave soldering. These components carry the full power load of the induction cooker — a single misaligned pin or missed insertion can cause arcing or open-circuit failure under heavy cooking use.
● Component type and orientation verified against an insertion map — operators follow a fixed station layout with visual guides, ensuring every IGBT, capacitor, and relay is placed in the correct position and polarity
● Pin-to-hole fit confirmed before the board moves on — each lead must pass fully through the PCB with no bending or partial insertion, guaranteeing solid solder contact at the wave-soldering stage
● ESD-safe handling enforced at every station — operators wear grounded wrist straps and work on anti-static mats to protect sensitive IGBT and driver components from static damage
● A final visual count completed before wave soldering — every through-hole position is checked to confirm full population, avoiding costly rework after soldering
Wave Soldering Machine — Automated Through-Hole Soldering
We pass every hand-inserted PCB through a fully automated wave soldering line to complete all through-hole joints in a single controlled pass. The IGBT module, filter capacitors, and relay pins all rely on this stage for their permanent electrical connection — a single dry joint on the main power path can cause intermittent failure or overheating during peak cooking output.
● Flux spray, preheat, and wave settings locked per board model — each PCB variant runs a pre-validated recipe to ensure consistent solder fill across all through-hole joints
● Solder pot temperature and wave height monitored in real time — any drift beyond tolerance triggers an automatic alert, stopping batch-level defects before they occur
● Post-wave AOI and visual inspection at line exit — every board is checked for bridging, insufficient fill, and solder skips before moving to functional testing
● Dross removal and solder purity maintained on schedule — regular composition checks keep the solder bath within spec, ensuring joint reliability across the product’s full service life


